IEEE AP-S/URSI 2023 || Portland, Oregon, USA || 23-28 July 2023

Institute of Electrical and Electronics Engineers (IEEE)

International Union of Radio Science

IEEE APS

U.S. NATIONAL COMMITTEE FOR URSI

National Academies Sciences Engineering Medicine

IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting

July 23–28, 2023 • Portland, Oregon, USA

23-28 July 2023 • Portland, Oregon, USA

IEEE AP-S/URSI 2023

23-28 July 2023 • Portland, Oregon, USA

FR-A5.5P.4

Wideband THz Yagi-Uda Bond Wire Antennas

Ivan Ndip, Fraunhofer IZM/Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Germany; Thi Huyen Le, Fraunhofer Institute for Relaibility and Microintegration, IZM, Germany; Martin Schneider-Ramelow, Fraunhofer Institute for Relaibility and Microintegration, IZM and Technische Universität (TU) Berlin, Germany

Session:

Planar Millimeter-wave Antennas

Track:

AP-S: Antenna Applications & Emerging Technologies

Location:

C 125-126 (OCC)

Session Time:

Fri, 28 Jul, 15:20 - 17:00 PDT (UTC -7)

Presentation Time:

Fri, 28 Jul, 16:20 - 16:40 PDT (UTC -7)

Session Co-Chairs:

Tarek djerafi, inrs and Ifana Mahbub, University of Texas at Dallas

Session FR-A5.5P

FR-A5.5P.1: A High Gain SIW Elliptically Polarized Antenna for Millimeter-Wave Applications

Pallav Sah, Ifana Mahbub, University of Texas at Dallas, United States

FR-A5.5P.2: A Fully Integrated Planar Dielectric Rod Antenna Based on SIIG Technology for mm-Wave Applications

Faisal Farooq, Abdelkader zerfaine, Mohamed Chaker, Tarek djerafi, inrs, Canada

FR-A5.5P.3: Temperature-based performance of millimeter-wave antenna-in-package

Oscar Medina, Aditya Jogalekar, Michael Mcgarry, Kannan Nambiar, Hongbing Lu, Mark Lee, Rashaunda Henderson, UT Dallas, United States

FR-A5.5P.4: Wideband THz Yagi-Uda Bond Wire Antennas

Ivan Ndip, Fraunhofer IZM/Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Germany; Thi Huyen Le, Fraunhofer Institute for Relaibility and Microintegration, IZM, Germany; Martin Schneider-Ramelow, Fraunhofer Institute for Relaibility and Microintegration, IZM and Technische Universität (TU) Berlin, Germany