2023 APS Logo

IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting

July 23–28, 2023 • Portland, Oregon, USA

23-28 July 2023 • Portland, Oregon, USA

IEEE AP-S/URSI 2023

23-28 July 2023 • Portland, Oregon, USA

FR-SP.1A.2

Low-Cost Stackable Patch Antennas-in-Package Integration to Enhance Spherical Coverage of Millimeter-wave Wireless Applications

Junho Park, Beakjun Seong, Inseok Jang, Nari Cha, Sehun Kim, KREEMO Inc., Korea (South); Wonbin Hong, POSTECH, Korea (South)
Session:
Enabling Antenna Technologies for Emerging Consumer Electronic Applications
Track:
Special Sessions
Location:
Oregon Ballroom 201 (OCC)
Session Time:
Fri, 28 Jul, 08:00 - 11:40 PDT (UTC -8)
Presentation Time:
Fri, 28 Jul, 08:20 - 08:40 PDT (UTC -8)
Session Co-Chairs:
Wonbin Hong, POSTECH and Jiang Zhu, Meta and Junho Park, KREEMO
Presentation
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Discussion
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Session FR-SP.1A
FR-SP.1A.1: A Magnetoelectric Dipole Antenna Structure for Scalable Phased Array Applications
DUIXIAN LIU, Xiaoxiong Gu, Christian Baks, IBM, United States
FR-SP.1A.2: Low-Cost Stackable Patch Antennas-in-Package Integration to Enhance Spherical Coverage of Millimeter-wave Wireless Applications
Junho Park, Beakjun Seong, Inseok Jang, Nari Cha, Sehun Kim, KREEMO Inc., Korea (South); Wonbin Hong, POSTECH, Korea (South)
FR-SP.1A.3: Component-level and system-level evaluations of metasurface on glass for 5G indoor communications
Hyengcheul Choi, Byounggwan Kang, Changhyeong Lee, Boyoung Kang, Corning Technology Center Korea,, Korea (South); Youngno Youn, Wonbin Hong, Pohang University of Science and Technology (POSTECH), Korea (South)
FR-SP.1A.4: Dual-band Antenna-in-Package (AiP) Front-end Module for 5G mmWave Mobile Device Applications
Gyoungdeuk Kim, Dohyun Kim, Sangkil Kim, Pusan National University, Korea (South); Kyungho Lim, Chanwoo Yang, Chisang You, LG Innotek, Korea (South)
FR-SP.1A.5: Integrated Millimeter-wave and Microwave Antennas for Smartphones
Jialu Xu, Dalian University of Technology, China; Huan-Chu Huang, Visionox Techology Inc., China; Hui Li, Dalian University of Technology, China; Jie Wu, Shuang Cui, Visionox Techology Inc., China
FR-SP.1A.6: Multi-Mode Multi-Port Antennas (M³PA) Increasing Flexibility of Antenna Arrays for 6G Joint Communication and Sensing
Dirk Manteuffel, Leibniz University Hannover, Germany
FR-SP.1A.7: Noise immune antenna (NIA) – a novel approach to mitigate desense for on-board antennas
khaled Obeidat, Sumitra Dey, Nauroze Syed Abdullah, Qiaolei Huang, Amazon, United States
FR-SP.1A.8: Creeping Wave on Body for VR Applications
Wenjing Su, Jiang Zhu, Meta, United States
FR-SP.1A.9: An Optically Transparent Antenna on Glasses for 2.4GHz WiFi
Yasuo Morimoto, Sam Shiu, Irene Huang, Eric Fest, Geng Ye, Jiang Zhu, Meta Platforms Inc., United States
FR-SP.1A.10: Phased Array Antenna-in-Package Design for True-Wideband mmWave 5G Communication
Haoran Zhang, Atif Shamim, King Abdullah University of Science and Technology, Saudi Arabia
Resources
No resources available.