IEEE AP-S/URSI 2023 || Portland, Oregon, USA || 23-28 July 2023

FR-A5.1P.1

Material Selection and Process Optimizations of Additive Interconnects in Printed Circuit Boards

Emily Lamport, Yuri Piro, Yibo Li, Andrew Luce, University of Massachusetts, Lowell, United States; Susan Trulli, Raytheon Missiles and Defense, United States; Alkim Akyurtlu, University of Massachusetts, Lowell, United States

Session:

Additively Manufactured Antennas and Structures

Track:

AP-S: Antenna Applications & Emerging Technologies

Location:

B 117-119 (OCC)

Session Time:

Fri, 28 Jul, 13:20 - 15:00 PDT (UTC -8)

Presentation Time:

Fri, 28 Jul, 13:20 - 13:40 PDT (UTC -8)

Session Co-Chairs:

Shailesh Pandey, Rogers Corporation and Emily Lamport, University of Massachusetts, Lowell and Jori Platt, University of Colorado Boulder and Yajie Chen, Rogers Corp

Session FR-A5.1P

FR-A5.1P.1: Material Selection and Process Optimizations of Additive Interconnects in Printed Circuit Boards

FR-A5.1P.2: Design of a Monolithic Monocone and Radome with a Conical Skirt Ground

Jori Platt, Dejan Filipovic, University of Colorado Boulder, United States

FR-A5.1P.3: High Performance Dual-Band antenna using Rogers Magneto-Dielectric Material for GNSS Band

Shailesh Pandey, Yajie Chen, Lance Young, Rogers Corporation, United States

FR-A5.1P.4: Additively Manufactured K-Band Septum Polarizers: A Comparative Study

Tayla Dahms, James Cook University, Australia; Stephanie Smith, Ken Smart, CSIRO, Australia; Graham Brodie, Mohan Jacob, James Cook University, Australia

FR-A5.1P.5: Horizontally Polarized Cylindrical Inverted-F Antenna Array Enabled by Additive Manufacturing

Isaiah Pisani, Songyi Yen, Dejan Filipovic, University of Colorado Boulder, United States

IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting

July 23–28, 2023 • Portland, Oregon, USA

Material Selection and Process Optimizations of Additive Interconnects in Printed Circuit Boards